1.生产,正性,负性,光刻胶,PR,安智AZ系列,AZ6112,AZ6130,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500,高感光度,高产出率,很宽的膜厚范围,适合干法刻蚀工艺,成分稳定,应用广
2.生产,正性,负性,光刻胶,PR,安智AZ系列,AZ3100,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500,G线,I线通用,高附着性,适合干法湿法刻蚀工艺,成分稳定,应用广
3.生产,正性,负性,光刻胶,PR,安智AZ系列,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500,高感光度,高附着性,适合湿法刻蚀工艺,成分稳定,应用广
4.圆片级封装(WLP)用,正性,负性,光刻胶,PR,安智AZ系列,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500AZ50XT,AZ10XT,高分辨率,高纵宽比,高附着性,电镀工艺高耐受性,凸点UBM工艺,成分稳定,应用广
5.圆形化衬底(PSS)用,正性,负性,光刻胶,PR,安智AZ系列,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500AZ,GXR-601,G线I线通用,高感光度,高产出率,适合干法刻蚀工艺,成分稳定,应用广
6.适合蒸镀正性,负性光刻胶,安智AZ系列,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500AZ5200,AZ5214E,高分辨率,很宽的膜厚范围,用于正/负反转,lift-off工艺,稳定性好
7.生产,正性,负性,光刻胶,PR,安智AZ-P,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500高对比度,高感光率,高附着性,电镀工艺耐受性好,成分稳定,可靠性高
8.显影液,无需表面活性剂,安智,AZ,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500厚膜专用,光刻胶,各种显影工艺,puddle,Dip,清晰度高
9.LED,芯片,CSP芯片级封装,正性,负性,光刻胶,AZ,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500,lift-off工艺,高膜厚,耐高温,蒸镀,成分稳定,应用广
10.适用,LED,芯片,CSP芯片级封装,正性,负性,光刻胶,AZ,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500,干法刻蚀工艺,高膜厚,耐高温,蒸镀,成分稳定,应用广
11.生产应用,LED,芯片,高压芯片(HV)倒装芯片(FC)正性,负性,光刻胶,AZ,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500,干法刻蚀工艺,高膜厚,耐高温,蒸镀,成分稳定,专业厂家
12.生产应用,LED,芯片,高压芯片(HV)倒装芯片(FC)正性,负性,光刻胶,AZ,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500,lift-off工艺,高膜厚,耐高温,蒸镀,成分稳定,专业厂家
13.生产应用,LED,芯片,高压芯片(HV)倒装芯片(FC)正性,负性,光刻胶,AZ,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500,lift-off工艺,高膜厚,耐高温,蒸镀,成分稳定,专业厂家
14.生产应用,LED,芯片,圆片级封装(WLP),正性,负性,光刻胶,AZ,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500,凸点UBM工艺,高膜厚,耐高温,电镀工艺耐受性,成分稳定,专业厂家
15. 生产应用,LED,芯片,Metal,mesh工艺,金属网格触摸屏,柔性,光刻胶,AZ,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500,高粘附力,耐刻蚀,铜蚀刻工艺,成分稳定,专业厂家
16. 生产应用,LED,芯片,Metal,mesh工艺,倒角图形,柔性,光刻胶,AZ,AZ1500,AZ 6112,AZ 6130,AZ 3100,AZ 50XT,AZ 10XT,AZ GXR-601,AZ 5200,AZ 5214E,AZ P4620,AZ P4400,AZ P4210,AZ P4330,AZ P4903,AZ 400K,AZ 300MIF,AZ1500,垂直角度,耐刻蚀,铜蚀刻工艺,成分稳定,专业厂家
17.盖板行业,喷涂防爆胶,曝光油墨,3D曲面玻璃,,BM光阻,快干,OD值高,喷涂油墨,耐酸碱,曝光能量低,分辨率高,成分稳定,效果好
18.盖板行业,喷涂防爆胶,曝光油墨,3D曲面玻璃,,感光油墨,快干,OD值高,喷涂油墨,耐酸碱,曝光曝光能量低,分辨率高,成分稳定,效果好
19.盖板行业,喷涂防爆胶,曝光油墨,3D曲面玻璃,,UV油墨,快干,OD值高,喷涂油墨,耐酸碱,曝光曝光能量低,分辨率高,成分稳定,效果好
20.盖板行业,喷涂防爆胶,曝光油墨,3D曲面玻璃,,透明光阻,高分辨率,透过率高,喷涂油墨,耐酸碱,曝光能量低,分辨率高,成分稳定,效果好
21.盖板行业,喷涂防爆胶,曝光油墨,3D曲面玻璃,,纹理油墨,高分辨率,透过率高,喷涂油墨,耐酸碱,曝光能量低,分辨率高,成分稳定,效果好
22.盖板行业,喷涂防爆胶,曝光油墨,3D曲面玻璃,,BM光阻,快干,OD值高,喷涂油墨,耐酸碱,曝光曝光能量低,分辨率高,成分稳定,效果好
23.盖板行业,3D曲面玻璃,喷涂,喷涂防爆胶,液体防爆胶,水性防爆膜,黑色,透明色,粘度好,强度高,产能高